Reliability And Safety Aspects
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Passive/Discrete Components Level
Reliability tests based on MIL-STD requirements for all passive components
Resistors: AEC-Q200 qualified components only, -55°C to 155°C, IEC 60115-8, JIS C 5201-8 and JEITA RC-2134C
MLCCs: AEC-Q200 qualified components only, -55°C to 125°C, soft termination, high resistance to board bending, mechanical stress, drop impact and thermal shock by resin layers
Inductors: AEC-Q200 qualified components only, shielded and low-profile series for vibration resistance and mechanical strength
Diodes and MOSFETs: AEC-Q101 qualified components only, -55°C to 125°C
PCB/PCBA Level
Controlled Stack-Up structure and materials: extreme thermal stability (High-Tg, stable CTE-z), CAF resistant, Low moisture absorption
Materials are recommended for Aerospace & Defense applications
Tin whiskers mitigation due to specific conformal coating
System Level
Redundant physical connections
Single Failure point mitigation techniques for Stand Alone models
Single Failure point free by-design for Modular models
Redundant by-design for Modular models
Connectors And IC Level
Hi-Rel Space Grade connectors, -55°C to +125°C, Vibration and Shock tolerant, protection against physical knocks, strain relief on cables
Military temperature range –55°C to +125°C
For the ICs there's one fabrication, assembly and test site
Excessive testing (see Qualification Matrix)
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